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Chip
Nylon Chip for
Engineering Plastic

Product

● 1023 BRT, 1011 BRT, 1021 BRT, 1027 BRT, 1031 BRT ● 나일론-6/ 나일론-66 공중합물 소재 개발 중 ● 글로벌 컴파운드 제조사의 소재 승인 완료 ● 사용 용도 : 자동차 부품, 전기전자 부품

Physical Properties

Physical Properties 테이블
Product Relative
Viscosity
Moisture
Content
Monomer
Content
Yellow
Index
Melting
Point
MI
(2.16kg)
Chip Shape Chip Size
Unit - % % - g/10min g/100ea
1023 BRT 2.30±0.03 0.05±0.02 Max 0.70 Below 2.0 220 107 Pillow 0.8
1011 BRT 2.45±0.03 0.05±0.02 Max 0.70 Below 2.0 220 60 Pillow 0.8
1027 BRT 2.70±0.03 0.05±0.02 Max 0.70 Below 2.0 220 38 Pillow 1.0
1021 BRT 2.97±0.03 0.06±0.02 Max 0.70 Below 2.0 220 20 Pillow 0.8
1031 BRT 3.48±0.03 0.06±0.02 Max 0.90 Below 2.0 220 9 Pillow 0.95
Method ISO 307 ISO 15512 ISO 6427 ASTM E313 ISO 3146 250℃

*1027CS : 우수한 이형성 및 결정화도 특성을 지닌 사출성형 그레이드

Strength

● 우수한 품질 안정성 ● 우수한 치수 안정성 ● 우수한 회복탄성력 ● 유리섬유 보강으로 우수한 기계적 특성 구현

Strength 테이블
ITEM Unit Method 1027 BRT + Glass fiber 30%
DRY COND. (50% RH)
Tensile Strength MPa ASTM D-638 180 150
Tensile Modulus MPa ASTM D-638 10,000 7,800
Elongation at Break % ASTM D-638 3.5 5
Flexual Strength MPa ASTM D-790 220 220
Flexual Modulus MPa ASTM D-790 8,700 6,700
Impact Strength
(Izod, Notched)
KJ/m2 ASTM D-256 15 19
Thermal Deflection
temperature (1.82MPa)
ASTM D-648 210 -
Specific Gravity - ASTM D-792 1.36 -

Application

Engineering plastic-TDS

Engineering plastic-TDS 테이블
Items Unit Method 1011 1027 1021 1031 Remark
Tensile Strength MPa ASTM D-638 73 74 75 75 50mm/min,115mm
Tensile Modulus MPa ASTM D-638 2,600 2,600 2,650 2,650
Elongation at Break % ASTM D-638 140 140 140 140
Flexual Strength MPa ASTM D-790 98 99 101 103 1.3mm/min, 51mm
Flexual Modulus MPa ASTM D-790 2,400 2,500 2,600 2,700
Impact strength
(Izod, Notched)
KJ/m2 ASTM D-256 6 6 7 7 At 23℃,
2.54mm(notch)
Thermal Deflection
Temperature
ASTM D-648 65 65 65 65 2℃/min, 1.82MPa
Vicat softening
temperature
ASTM D-1525 195 195 195 195 2℃/min,50N
Rockwell Hardness R-scale ASTM D-785 120 120 120 120
Coeff. of Linear
Thermal Expansion
Cm/cm. ℃ ASTM D-696 0.8 0.8 0.8 0.8
Thermal
Conductivity
W/m. °F ASTM D-177 1.7 1.7 1.7 1.7
Dielectric Strength KV/mm ASTM D-149 19 19 19 19
Specific Gravity - ASTM D-792 1.14 1.14 1.14 1.14
Mold Shrinkage /t(1/8”) % ASTM D-955 1.0 ~ 1.6 1.0 ~ 1.6 1.0 ~ 1.6 1.0 ~ 1.6
Moisture Absorption % ASTM D-570 1.5 1.5 1.5 1.5 At 23℃,
24hrs, water
Relative Viscosity - ISO 307 2.45 2.7 2.97 3.48
Melt Flow Index g/10min ASTM D-1238 60 38 20 9 2.16kg, 250℃

*Water Absorption condition: 23℃, Equilibrium 50%RH

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